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Sudesh Bhagwat | 2 Nov 2009 08:15
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vertical taper PR profile

Hi Qiu,

Sometime back I was working on these kind of structures and I was using 
CTP-100  Negative tone photoresist from Clariant.
With exposure gaps of ~ 4-6 micron I was getting profiles with angles 
ranging from 45 to 70 degrees.

sudesh

>
>  Dear All,
>
>     We are trying to get the vertical taper PR profile with 8mm size and =
> 0-1.5um thickness. Can anyone give us some suggestion?  We want to avoid =
> a grey scale mask, since they are so costly.
>
> Thanks a lot
>
> Qiu
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yiyang dong | 2 Nov 2009 15:29
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Windows XP simulation workstation hardware

Dear all,

I want your advice on a desktop computer as a workstation to run
Exceed/Gambit/Fluent on windows xp, my research interest is
microfluidics, and currently want to perform CFD.  Which configuration
should i need?  pls consider the C/P value.

Your timely advice is highly appreciated.

Thanks.

--

-- 
Yiyang Dong, Ph.D.
Associate Director
Institute of Industrial Products
Chinese Academy of Inspection and Quarantine
No.3A,North Gaobeidian Road, Chaoyang District, Beijing 100123, P.R. China

Tel: +86-10-85773355 ext. 2254
Fax:+86-10-85772625
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Brian Stahl | 3 Nov 2009 02:01
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Spectroscopic Reflectometer

Hello Everyone,

I'm in the market for a spectroscopic reflectometer tool for measuring thin
film stacks, and one of the vendors I've been talking to is Angstrom Sun
Technologies.  I'm also looking at Filmetrics, however the system I need is
considerably less expensive from Angstrom Sun Technologies.  Have any of you
ever worked with them or their systems, and if so would you be willing to
give me your opinion of them (service, reliability, meeting expectations,
etc.)?

Thanks,

Brian C. Stahl
Graduate Student Researcher
UCSB Materials Research Laboratory
brian.stahl <at> gmail.com / bstahl <at> mrl.ucsb.edu
Cell: (805) 748-5839
Office: MRL 3117A
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jianqiang gu | 3 Nov 2009 08:14
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Dicing Polyimide Layer

Hi Everybody,

Does anyone have experience with dicing hard cured polyimide layer (PI2525, HD Microsystems)? I have a
silicon wafer covered by a 100um thickness hard cured PI2525 layer. I have to cut the polyimide layer into
5mm*5mm pieces by my dicing saw. I'm wondering which kind of blade I should choose and what is the proper
spindle speed of the saw? 

Thanks in advance.
Jianqiang Gu
Oklahoma State Univ.
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Miyakawa, Natsuki | 3 Nov 2009 15:18
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Anodic bonding

Dear all,

When I bond glass wafer (Borofloat33, Schott) with silicon wafer
anodically, then I observe lot of small spots on the back side of the
glass wafer which make the glass to appear rather cloudy. So far as I
understand  this phenomenon is due to locally concentrated sodium ions.

My question: Is there any method to avoid this happens so that the glass
wafer remains clear and transparent after the anodic bonding?

Thanks!

Regards

Natsuki  

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Miyakawa, Natsuki | 3 Nov 2009 15:32
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Laser cutting of silicon

Dear all, 

After cutting silicon wafer with laser (frequency-tripled Nd:YAG-laser with wave length 355nm) I
observe that the silicon surface turned quite rough around the cutting edge (height up to ~1µm, width ~
50µm). Do you know some trick to avoid or remove this surface roughening so that the surface quality is
good enough for silicon fusion bonding after laser cutting?

Thank you!

Cheers

Natsuki

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Dave Lewis | 3 Nov 2009 16:40
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Re: Spectroscopic Reflectometer

Are they related to Sun Microsystems?  If so, I have worked with an NMR
interface that they produced. It was quite user friendly and seemed to
perform above most expectations.

Regards,
Dave Lewis

-----Original Message-----
From: mems-talk-bounces <at> memsnet.org
[mailto:mems-talk-bounces <at> memsnet.org] On Behalf Of Brian Stahl
Sent: Monday, November 02, 2009 8:01 PM
To: General MEMS discussion
Subject: [mems-talk] Spectroscopic Reflectometer

Hello Everyone,

I'm in the market for a spectroscopic reflectometer tool for measuring
thin
film stacks, and one of the vendors I've been talking to is Angstrom Sun
Technologies.  I'm also looking at Filmetrics, however the system I need
is
considerably less expensive from Angstrom Sun Technologies.  Have any of
you
ever worked with them or their systems, and if so would you be willing
to
give me your opinion of them (service, reliability, meeting
expectations,
etc.)?
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
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Dave Lewis | 3 Nov 2009 16:43
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Re: Dicing Polyimide Layer

With features that small, you may be better off laser cutting the parts.
Dicing through the silicon tends to affect the optical characteristics
of the part especially areas closer to the saw.

Regards,
Dave Lewis

-----Original Message-----
From: mems-talk-bounces <at> memsnet.org
[mailto:mems-talk-bounces <at> memsnet.org] On Behalf Of jianqiang gu
Sent: Tuesday, November 03, 2009 2:15 AM
To: mems-talk <at> memsnet.org
Subject: [mems-talk] Dicing Polyimide Layer

Hi Everybody,

Does anyone have experience with dicing hard cured polyimide layer
(PI2525, HD Microsystems)? I have a silicon wafer covered by a 100um
thickness hard cured PI2525 layer. I have to cut the polyimide layer
into 5mm*5mm pieces by my dicing saw. I'm wondering which kind of blade
I should choose and what is the proper spindle speed of the saw? 

Thanks in advance.
Jianqiang Gu
Oklahoma State Univ.
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org
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DongJuan Xi | 3 Nov 2009 16:55
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Re: Dicing Polyimide Layer

use laser at 355 nm wavelength.

On Tue, Nov 3, 2009 at 7:43 AM, Dave Lewis <dave.lewis <at> lakeshore.com> wrote:
> With features that small, you may be better off laser cutting the parts.
> Dicing through the silicon tends to affect the optical characteristics
> of the part especially areas closer to the saw.
>
> Regards,
> Dave Lewis
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Brad Johnson | 3 Nov 2009 17:17

Re: Anodic bonding

Hello Natsuki,

There are a couple of tricks you can try.  The easiest is to place a second piece of float glass on top of your
sample, the Na will migrate into this glass and give you a better looking surface.  I have also used sheets of
graphite foil but it really makes a big mess to clean up and can contaminate your bonder with particles.  You
can also place a graphite puck on top of your sample, these can be cleaned many times then thrown out when
they load with NA or start to fall apart.

Try putting on a second piece of float glass and you should be happy with the outcome.  Most of the time you can
remove the Na from the surface with Di water.

Good luck,
Brad 

Brad Johnson
Application Engineer
DJK Global
US Distributor, Semiconductor Inspection Systems
2447 W. 12th St. - Suite 6, Tempe, AZ 85281
480-968-3343 Ext 112 office
602-501-4413 cell
bjohnson <at> djksemi.com
http://www.djksemi.com
 

-----Original Message-----
From: Miyakawa, Natsuki [mailto:Natsuki.Miyakawa <at> eads.net] 
Sent: Tuesday, November 03, 2009 7:18 AM
To: General MEMS discussion
Subject: [mems-talk] Anodic bonding
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Gmane