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X.Guo | 2 Jan 2005 04:29
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looking for any materials transparent to excimer laser

Dear all,

Happy the new year!
Does someone know any materials easy to deposit that is transparent to the excimer laser (such as KrF)?

Thank you very much

Regards, 
Xiaojun
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Jukka.Viheriala | 3 Jan 2005 10:28
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Plating Au on Ni.

Hello,

We are making process where we would like to plate gold features using
thick PR-mold. Process we had in mind was following:

1.    Evaporate Ni layer on GaAs-wafer.
2.    Make thick PR-mold
3.    Plate Au-trough mold on Ni
4.    Remove PR
5.    Etch Ni away using plated Au as a etch mask

However we have problems with plating on Ni. It just is not plating
anything. Should we try to make some pretreatment to Ni before try to plate
Au?

We have fresh and clean chemical with correct pH. Also plating Au on Au is
working correctly. We are making our plating with Enthone Nuronex 309B
plating solution (should be same stuff than Microfab Au150).

Best regards,
Jukka Viheriälä

***********************************************
Jukka Viheriälä, Researcher

Optoelectronics Research Centre
Tampere University of Technology
P.O. Box 692
FIN-333101 Tampere, Finland
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Aashish Singh | 3 Jan 2005 14:13
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measuring film thickness and Refractive index after spin coating


Dear friends,
  I have spin coated a thin Layer of PMMA over Quartz block in my laboratory. I want to measure the film
thickness and Refractive index, can anybody suggest some way of doing it.
   Your help will be heartly appreciated.

regards
Aashish Singh
Project Associate
Department of Physics
Indian Institute of Technology, Delhi
New Delhi-16
INDIA
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Michael.Kobusch | 3 Jan 2005 15:25
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Adhesion problem with electroplated metal layers (Au or Ag)

Adhesion problem with electroplated metal layers (Au or Ag) 

Hello all,

We experience problems with the electroplating of Au (thickness of about 5 
microns) on oxidized Si-wafers (100) with structured Cr/Au seed layer (10 
nm and 30 nm, resp.). The front surface features an 8x16 array of 
edge-connected squares of 10 mm2 area. The back side is coated with Cr 
only. So far, the produced metallic structure easily flakes off from the 
SiO2 substrate during or after the electroplating process (ORIMA B, 
Schl&#246;tter GmbH, PH 4.2). Separated flakes and the edges of surviving metal 
patches bends outwards. Furthermore, the layered metal foil is quite 
brittle. Tests with Ag instead of Au showed similar problems. 

Could someone tell me what probably went wrong and how we can fix these 
problems?

Regards

Michael Kobusch

michael.kobusch <at> ptb.de

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David Nemeth | 3 Jan 2005 15:56

RE: looking for any materials transparent to excimer laser

David

You might look into MgF2, CaF2, and perhaps even SiO, depending on
thickness.   Check out www.lesker.com for information on possible deposition
methods.  For example, MgF2 is available in sputtering sources.
http://www.lesker.com/newweb/Deposition/Sputter_Targets/ElementNames_J_P/Ma_
magnesiumFluoride.cfm?CFID=581512&CFTOKEN=28963401&section=magcomps&init=ski
p

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
Cell: (202) 288-1067
Ph: (703) 961-9573 x206
Fax:(703) 961-9576

-----Original Message-----
From: mems-talk-bounces <at> memsnet.org
[mailto:mems-talk-bounces <at> memsnet.org]On Behalf Of X.Guo
Sent: Saturday, January 01, 2005 10:30 PM
To: mems-talk
Subject: [mems-talk] looking for any materials transparent to excimer
laser

Dear all,

Happy the new year!
Does someone know any materials easy to deposit that is transparent to the
(Continue reading)

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Borski, Justin | 3 Jan 2005 16:39

RE: Plating Au on Ni.

Try an H2N2 descum at low power and low temperature before plating.  I
wouldn't try any acid dip processes, too dangerous around gold plating
baths..

I would suggest trying a Matrix 105 system plumbed with H2N2 running at 100W
500mT 2 minutes 30 degrees C.

- Justin

-----Original Message-----
From: Jukka.Viheriala <at> orc.tut.fi [mailto:Jukka.Viheriala <at> orc.tut.fi]
Sent: Monday, January 03, 2005 4:28 AM
To: mems-talk <at> memsnet.org
Subject: [mems-talk] Plating Au on Ni.

Hello,

We are making process where we would like to plate gold features using
thick PR-mold. Process we had in mind was following:

1.    Evaporate Ni layer on GaAs-wafer.
2.    Make thick PR-mold
3.    Plate Au-trough mold on Ni
4.    Remove PR
5.    Etch Ni away using plated Au as a etch mask

However we have problems with plating on Ni. It just is not plating
anything. Should we try to make some pretreatment to Ni before try to plate
Au?
(Continue reading)

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David Nemeth | 3 Jan 2005 17:13

RE: Plating Au on Ni.

The nickel oxidizes on contact with air.  Follow the nickel evaporation with
a gold evaporation (a few hundred angstroms should be fine).  Do not break
vacuum between the depositions.  The gold plating should then work.

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
Cell: (202) 288-1067
Ph: (703) 961-9573 x206
Fax:(703) 961-9576

-----Original Message-----
From: mems-talk-bounces <at> memsnet.org
[mailto:mems-talk-bounces <at> memsnet.org]On Behalf Of
Jukka.Viheriala <at> orc.tut.fi
Sent: Monday, January 03, 2005 4:28 AM
To: mems-talk <at> memsnet.org
Subject: [mems-talk] Plating Au on Ni.

Hello,

We are making process where we would like to plate gold features using
thick PR-mold. Process we had in mind was following:

1.    Evaporate Ni layer on GaAs-wafer.
2.    Make thick PR-mold
3.    Plate Au-trough mold on Ni
4.    Remove PR
(Continue reading)

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ikadija | 3 Jan 2005 17:29

Re: Plating Au on Ni.

Jukka,

Ni oxidizes easily. It is estimated that on RT it forms an oxide layer that
interferes with plating within few minutes, at 50C in less then one minute.
As it is difficult to process Ni substrate in short time after deposition
and keep it from oxidation you need to apply an acidic rinse, e.g. 15% HCL
(30% diluted with DI water 50/50) for app. 1 minute - this must be
established as a function of oxide thickness), followed by short rinse
(app.10 sec) at RT with a dilute sulfite solution or other solution
depending on the type of your gold solution at pH adjusted to that of Au
plating solution or slightly more acidic (If your Gold is alkaline solution
it becomes more dificult to electroplate Ni - the more alkaline solutions
form faster Ni oxide). That is to minimize the contamination of Au solution.

The process is achievable but it requires ease of handling and practice. To
this end we offer equipment that is designed to minimize uncertainties in
timing and wafer handling. Our IKoClassic is an ideal tool as it enables
precise setting and easy optimization of processing parameters including
wafer preparation and electroplating. More details can be found in our
website www.fibrotools.com.

Sincerely,

I. Kadija
President, CEO
ECSI

----- Original Message ----- 
From: <Jukka.Viheriala <at> orc.tut.fi>
To: <mems-talk <at> memsnet.org>
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Clements, Jim - Erie | 3 Jan 2005 19:13

RE: measuring film thickness and Refractive index after spin coating

Ellipsometry would be the most appropriate. 
Some vendors might do a sample gratis, but you'd need to ask.
Hope this helps.
Jim

-----Original Message-----
From: mems-talk-bounces <at> memsnet.org
[mailto:mems-talk-bounces <at> memsnet.org]On Behalf Of Aashish Singh
Sent: Monday, January 03, 2005 8:14 AM
To: MEMS-talk <at> memsnet.org
Subject: [mems-talk] measuring film thickness and Refractive index after
spin coating

  
Dear friends,
  I have spin coated a thin Layer of PMMA over Quartz block in my laboratory. I want to measure the film
thickness and Refractive index, can anybody suggest some way of doing it.
   Your help will be heartly appreciated.

regards
Aashish Singh
Project Associate
Department of Physics
Indian Institute of Technology, Delhi
New Delhi-16
INDIA
_______________________________________________
MEMS-talk <at> memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
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gokul ramamani | 3 Jan 2005 22:56
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RE: plating au on nickel


Hi Jukka Viheri&#228;l&#228; :

Au does not plate on Ni very well i.e if you are doing electroless plating.
I would suggest that you may try to deposit a thin film of gold  by 
sputtering and then do wet etching or lift off to define ur pattern and then 
do electroless plating which should be pretty easy since au would only get 
deposited over the existing au.

Gokul Ramamani

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>Subject: MEMS-talk Digest, Vol 27, Issue 1
>Date: 3 Jan 2005 09:02:01 -0800
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Gmane