unkown unknown | 1 Jun 04:34 2004
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hi

i am facing problem in my MEMS project in polytechnic.i need help. i am 
doing a project of deposit aluminium on the side wall of a wafer..i would 
like to find more info but can;t find it on the net. Do u have any revalent 
document or webpage tat can assist me?thanks

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Daniel Shaw | 1 Jun 05:41 2004

RE: Electrostatic Actuation using ANSYS

BDK:

You cannot combine CIRC124 and SOLID123 in the same model.  If you want to use CIRC124, then you need to use
TRANS126 to represent the electrostatic-structural behavior.  TRANS126 and CIRC124 have identical
VOLT DOFs. They can be used in the same model (see example in "Coupled-Field Analysis Guide").

Regards,

Daniel Shaw
******************************************************

-----Original Message-----
From: mems-talk-bounces+daniel.shaw=ansys.com <at> memsnet.org
[mailto:mems-talk-bounces+daniel.shaw=ansys.com <at> memsnet.org]On Behalf Of
Mems II
Sent: Saturday, May 29, 2004 9:17 PM
To: mems-talk <at> memsnet.org
Subject: [mems-talk] Electrostatic Actuation using ANSYS

Hello,
   I am trying to simulate "electrostatic actuation" analysis in ANSYS 8.0. I am using multifield solver
approach. Electrostatic element used in the analysis is SOLID123. I want to introduce a resistor and
voltage source using element CIRCUIT124. But since both these elements have VOLT degree of freedom,
ANSYS does not accept these elements in one analysis. How can I connect a voltage source to electrostatic
eleent via resistor (So that there will be voltage drop across resistor) ?
   If anyone could help me, that will be great help for me. You can contact me at memsdevice <at> yahoo.co.in .

Regards,
BDK

(Continue reading)

Burkhard Volland | 1 Jun 09:27 2004
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Re: Passivation layer thickness in DRIE

Hello,

that depends on the passivation cycle duration. The deposition rate is
roughly about 30 nm/min (for a CHF3/CH4 plasma, depend. on process
conditions). Dauksher et al. report a depo. rate of 120 nm/min for a C4F8
plasma (W.J. Dauksher et al., J. Microelctronic Engineering 57-58, pp
607-612 (2001) ).
The polymer at the bottom gets completely removed during the etching cycle,
while the film at the sidewall survives the etching cycle, although gets
etched/sputtered at low rate. Therefore, the film thickness at the sidewalls
accumulates during the various passivation cycles. A natural stop for the
cumulative film thickness growth at the sidewalls is the undercutting depth:
If the film is as thick as the size of the scallopes or ripples, it's no
longer shadowed by the mask, hence subject of ion bombardement resulting in
fast sputtering rate.
In general, the film thickness may be between a few 10 nm up to ~100 nm,
depending on your process conditions. The size of undercutting or of the
scallopes/ripples can be considered as an upper limit.

In the rare case that the deposition layer is thick enough (long passivation
cycle duration), you can measure by SEM'ing the cross section of a profile.

Best regards

Burkhard Volland

-----Urspr黱gliche Nachricht-----
Von: Shawn Zhang <shawnzxd <at> ust.hk>
An: mems-talk <at> memsnet.org <mems-talk <at> memsnet.org>
Datum: Montag, 31. Mai 2004 19:46
(Continue reading)

Bill Moffat | 1 Jun 17:42 2004

RE: Development problem

YES, easy answer is Image Reversal.  I will contact with full details.  Bill Moffat

-----Original Message-----
From: JamYang <at> ITRI.ORG.TW [mailto:JamYang <at> ITRI.ORG.TW]
Sent: Sunday, May 30, 2004 7:57 PM
To: mems-talk <at> memsnet.org
Subject: [mems-talk] Development problem

Dear Sir
My pattern is pillars array
Period 300nm, one pillar diameter 100nm
After development,
Some pillars are still there, but some collapse
And the ratio chages.
Seldom it's perferct.
Is there a way to do it perfectly always?
Thank you

Best regard

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BRAD JOHNSON | 1 Jun 18:14 2004

Re: How can I strip off ARC from GaP

Try an RCA1 (SC1) dip.  This has worked for me but it is slow.  If you do not have any metal an over night dip in room
temp RCA1 should do the trick.
Good luck,
Brad Johnson
Applications Engineer
SUSS MicroTec
bjohnosn <at> suss.com 

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Patrick Poissant | 1 Jun 22:52 2004
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Gold/photoresist etching problems

Hello all,

I put gold on photoresist and I want to etch that gold in my process. I used
the KI/I2/H2O solution but it seems to attack my photoresist since I'm not
able to take it off after the etching. I tried HCl:HNO3 3:1 but it severely
attacks my nickel structures.

Is it normal the KI solution do strange things on photoresist?

Is there any other gold enchants that is selective on nickel?

I could use any other metal than gold that is selective on nickel but it
needs to don't crack on baked photoresist (95°C) in an oven.

Thanks for any help

Patrick Poissant
___________________________________________________
   M.A.Sc. Student
   Dept. of Electrical Engineering
   Université de Sherbrooke
   Sherbrooke (Québec) J1K 2R1
   CANADA
   patrick.poissant at usherbrooke.ca
   Sherbrooke Microelectronics Research Group
   www.gel.usherb.ca/gms

   Anyone who has never made a mistake has never tried anything new - Albert
Einstein

(Continue reading)

Dhanamjaya R Guda | 2 Jun 02:14 2004

Regd KOH Etchant Preparation


Hi everyone,

I am trying to prepare a recipe for etching Silicon <100>. I have no idea
right now,and I am a beginner in this field.
I need to have make a V-groove in Silicon wafer(Substrate)and I was
wondering can any one of you answer these questions:

1) Which oxidizing agent is best suited to produce smooth surface with
reduced hillocks ?
2)what amount of the oxidizing agent do I need to add to the 30% KOH
solution?

The recipe which I have right now is
70 g KOH pellets
190 ml DI water
40 ml isopropyl alcohol

Thanks,
Dhanamjaya Reddy Guda
Louisiana State University,
Phone: (225) 578-4412
Fax: (225) 578-9195

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dpkgp | 2 Jun 07:11 2004

Need help in Bonding

 Dear Sir/Madam,

        I am febricating an Accelerometer.I have two part one is cantilever with tip and other is Base electrode
assembly.I have to bond ,two parts. Could you please tell me the best bonding method between gold
layer(1000A)and SiO2 layer(0.8 um).

Thanks & Regards

Debasish PaulIndiatimes Email now powered by APIC Advantage. Help! 
HelpClick on the image to chat with me
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Samir Kagadkar | 2 Jun 16:04 2004
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biomems query

Hello there

I have a few basic bioMEMS queries. A device of mine has an array of
cantilevers with one side of each coated with biomolecules (antibodies).

*How do I coat different cantilevers with different antibodies? ( I donot
want antibodies for cantilever A to get onto cantilever B)

*what is a micro/nano pipette? (Do I need it for the above qn?)

*I am doing a test of antigens in blood. So what I have is a chamber with
my cantilever(s) and serum floating about. Say the blood does have a
particular qty of antigens and it does get stuck to the antibodies
specific to it on the cantilever. Thus there is a deflection which I
measure and hence I know how many molecules got stuck to the cantilever
(can someone also elaborate on how i do this). Now how do I relate the
concentration of the antigens in the serum to that on my cantilever? Is it
probabilistic? Or do I have to aim a fixed qty of serum only on the
cantilever so that every (?) molecule gets stuck????

Plz help me out.

Thanks a million

Samir

Samir Kagadkar
Deptt of Electrical Engg
Indian Institute of Technology Bombay

(Continue reading)

Reiner Witte | 2 Jun 18:27 2004

RE: biomems query

Try out the University of Tennessee, Professor Michael Sepaniak. He did some
work on "Chiral and Achiral Biosensing using Nanostructured
microcantilevers".

Best,

<[ -----Original Message-----
<[ From: Samir Kagadkar [mailto:samirkag <at> iitb.ac.in]
<[ Sent: Wednesday, June 02, 2004 10:05 AM
<[ To: General MEMS discussion
<[ Subject: [mems-talk] biomems query
<[
<[
<[ Hello there
<[
<[ I have a few basic bioMEMS queries. A device of mine has an array of
<[ cantilevers with one side of each coated with biomolecules
<[ (antibodies).
<[
<[ *How do I coat different cantilevers with different
<[ antibodies? ( I donot
<[ want antibodies for cantilever A to get onto cantilever B)
<[
<[ *what is a micro/nano pipette? (Do I need it for the above qn?)
<[
<[ *I am doing a test of antigens in blood. So what I have is a
<[ chamber with
<[ my cantilever(s) and serum floating about. Say the blood does have a
<[ particular qty of antigens and it does get stuck to the antibodies
<[ specific to it on the cantilever. Thus there is a deflection which I
(Continue reading)


Gmane