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Paolo Bondavalli | 1 Dec 2003 09:32

Re: Looking for information on low temperature glass-frit sealingprocess

Dear Hu,
It is not possible to reach less than 390°C.
If it was possible, everybody could use it!
Bye

Huxiaodong a écrit :

> Dear MEMS Community,
> Does anyone know about any glass-frit bonding process for WLP package of MEMS devices that has a process
temperature below 300 Celcuis degree?
> Any information will be greatly appreciated.
> Yours Sincerely,
> Hu Xiaodong.
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anshu mehta | 1 Dec 2003 10:12
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Wet etching Buffered HF/Glycerol

Hi

We use wet etching for sacrificial etching of oxide
followed by supercritical CO2 drying.
For the wet etch, we use a solution of 2 Buffered HF:1
glycerol because of exposed Al contact pads. Following
the etch, we rinse the sample in glycerol, DI water
and then IPA. However, we observed during the methanol
rinse, some form of crystals are formed on the surface
of the sample, which stay even after drying.
Sometimes, a little longer etch helps to get rid of
some of it, but not all. 
I wanted to ask if anyone else has observed the same
and has some solution for it. 
Also, we think it is because of glycerol residues
which is difficult to rinse away. Has anyone worked
with a lower glycerol concentration, and does it
shield the Al pads well? 
Also, we were consdiering removing these crystals by a
O2 plasma etch. Is that recommended? Please suggest.

Thanks,
Anshu Mehta. 

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David Nemeth | 1 Dec 2003 15:53

RE: Diamond

Don't overlook the possibility of Silicon Carbide, which is diamond-like in
many aspects.

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
Ph: (703) 961-9573 x206
Fax:(703) 961-9576

-----Original Message-----
From: mems-talk-bounces+nemeth=sophiawireless.com <at> memsnet.org
[mailto:mems-talk-bounces+nemeth=sophiawireless.com <at> memsnet.org]On
Behalf Of VIKAS
Sent: Wednesday, November 26, 2003 10:43 AM
To: General MEMS discussion
Subject: [mems-talk] Diamond

Hi,
Can anyone give me some information about the feasibility of diamond as a
bearing material, particularly the cost of fabrication etc. Any good links
would be helpful.
Thank you

Vikas
Senior Undergraduate,
Mechanical Engineering Dept.
IIT Bombay.
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John Maloney | 1 Dec 2003 16:45

Diamond as a bearing material

> Hi,
> Can anyone give me some information about the feasibility of 
> diamond as a bearing material, particularly the cost of 
> fabrication etc. Any good links would be helpful. Thank you

This paper covers tribology of several thin films, including diamondlike
carbon (DLC):

Beerschwinger et al, 1994, "A study of wear on MEMS contact
morphologies," J. Micromech. Microeng. 4, pp 95-105.

The DLC was a 0.7um layer deposited by LPCVD at 150-200C.  They don't
mention the precursor gas, but methane is commonly used.  The DLC layer
exhibited less wear than single crystal silicon, polySi, thermal oxide,
or PECVD nitride.  More significantly, the rate of wear decreased during
testing, suggesting than after initial surface smoothing the wear rate
was extremely low.

John Maloney
Senior MEMS Engineer
MicroCHIPS, Inc.
www.mchips.com

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Z.,W.Y.(Lydia | 1 Dec 2003 17:08
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Wet etch Gu with Sulfuric acid/hydrogen peroxide

Dear all,

Can I wet etch Gu with Sulfuric acid/hydrogen peroxide? What is the mixture 
ratio and temperature? Thanks!

Lydia

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Robert Dean | 1 Dec 2003 22:44
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need wafers ASAP

Hello,

Does anyone have some 100mm diameter silicon wafers 400um thick or thicker, 
with a resistivity of 1 to 10 Ohm-cm; with a good electrically insulating 
layer of SiO2 5um thick on the polished side?  If so, I would like to 
discuss purchasing them immediately, for use in a MEMS project.

Sincerely,

Robert Dean

Research Associate IV
Center for Advanced Vehicle Electronics
Auburn University
200 Broun Hall
Auburn, AL 36849

Voice: 334-844-1838
Fax:   334-844-1898
Email: rdean <at> eng.auburn.edu
Web: http://www.eng.auburn.edu/~deanron

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Xiaohui Li | 2 Dec 2003 05:59
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Help: how to reflow SU-8 after crosslinking

Hi,

I am trying to reflow SU-8 after cross-linking.  Looks that SU-8 is very 
difficult to reflow after cross-linked although it has a glass transition 
temperature.  Did anyone reflow SU-8 before?  Can I get some suggestions?

I really appreciate any suggestions.

Xiaohui

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cindy seah | 2 Dec 2003 07:51
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Why did platinum peel off ?

Hi,
    I'm currently doing a reseach project on deposting platinum over silicon.
and i know that platinum will peel off from the silicon layer and titianium can be use as a adhesion layer for
the platinum to stick on. Can i know the reason on why platinum doesn't stick on silicon and why does
titanium stick?
and lastly where can i find more information on this and the process of depositing platinum over silicon....

Thanks alot!!!
Cindy Seah
Nanyang Ploytechnic

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Tim Watson | 2 Dec 2003 16:16
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RE: Wet etching Buffered HF/Glycerol

Anshu,

The crystals you are describing are more than likely dendrites, which
could be coming from the aluminum contact pads.  

I have encountered similar situations when working with nitric acid as
an etchant.  During those etches there was no glycerol present, so I do
not think the dendrite growth you are experiencing is necessarily caused
by glycerol residues.  To resolve the dendrite issues, our chemist tried
various rinsing techniques, which involved different solvents and the
orders-of-operation.  In the end it appeared some solvents were the
catalyzing agent in the dendrite growth, and we found that an acetone
rinse, followed by a D.I. water rinse, and then N2 dry worked the best.

For your situation, you may want to characterize your rinse process by
changing the rinsing agents and the orders-or-operation until you can
determine which step is causing the dendrite growth.  If you have a DOE
established, this can be accomplished in a short period of time.

Hope this helps!

Best Regards,

Tim Watson
Microfabrication Technician
MicroMD laboratory
1381 Kinnear Road, Suite 100
Columbus, OH 43212
Tel: 614-688-8474
Fax: 614-688-3379
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Kim Norris | 2 Dec 2003 17:14

RE: need wafers ASAP

Robert,
	Montco Silicon Technologies can supply the wafers you are requesting.  Please contact them at
610-948-6880 for a quotation.
Kim

-----Original Message-----
From: Robert Dean [mailto:rdean <at> eng.auburn.edu]
Sent: Monday, December 01, 2003 4:45 PM
To: General MEMS discussion
Subject: [mems-talk] need wafers ASAP

Hello,

Does anyone have some 100mm diameter silicon wafers 400um thick or thicker, 
with a resistivity of 1 to 10 Ohm-cm; with a good electrically insulating 
layer of SiO2 5um thick on the polished side?  If so, I would like to 
discuss purchasing them immediately, for use in a MEMS project.

Sincerely,

Robert Dean

Research Associate IV
Center for Advanced Vehicle Electronics
Auburn University
200 Broun Hall
Auburn, AL 36849

Voice: 334-844-1838
Fax:   334-844-1898
(Continue reading)

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