Janis Klavins | 28 Jul 09:28 2014

[mems-talk] Strange expanded areas in SU8 structure.

Hello all,

I have a strange problem with SU8 structures. When we expose and develop 
the structure it is wider than necessary in SEM image it is possible to 
see that those wider areas are somehow different and the side of the 
structure is "fluffy" not straight and even. (see the image below.
I believe it might be one of the following:
1) Over-exposure: I cannot change exposure time due to additional 
adhesion problems
2) Mask is in proximity instead of contact mode: thickness of coating 
varies by 1 um (I do not think that it should make such a problem)
3) Something wrong in Post-exposure (too long or too hot)

Does anyone with greater experience with SU8 could suggest anything?

--

-- 
Best regards,
Mr. Janis Klavins
EuroLCDs
Phone: +37163600300
Mobile: +37126141049

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Sebastian R Freeman | 23 Jul 17:00 2014

[mems-talk] RIE Silicon etching

Hi everyone,

I am etching a 4-inch silicon wafer in the RIE using O2, and CF4, in
combination. Using positive photoresist, my goal is to create an array of
silicon pillars covering the surface of the wafer. I am trying to push the
limits of the machine, and trying to etch several microns. I etched for 5
minutes and was able to get 1.5 micron tall pillars, the wafer came out of
the machine very dirty, with a film-like residue on it, and looking very
scratched up. I think I might have an idea of what this is, but I would
appreciate anyone else's input, or a way to prevent it.

*Sebastian Freeman*
*Ph.D Student*

*Binghamton University *

*Thomas J. Watson School of Engineering*
*Department of Bioengineering*
*Office: Biotechnology Building 2629*
*E-mail: sfreema1 <at> binghamton.edu <sfreema1 <at> binghamton.edu>*
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Gianmario Scotti | 15 Jul 12:46 2014
Picon

[mems-talk] What glue for Kapton?

Dear all,

I am may need to glue a thin sheet of Kapton onto one of my chips.  I am
thinking about PDMS, but am unsure how well it bonds to Kapton. Did anyone
try this?

mario

-- 
Gianmario Scotti

Researcher
Aalto University, Dept. of Materials Science and Engineering
http://materials.aalto.fi/en/

Micronova, Tietotie 3
02150 Espoo
Finland
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Matthieu Nannini | 8 Jul 00:44 2014
Picon

[mems-talk] Unremoved SU-8 after exposure

Quick test: do you rinse the PGMEA with IPA ? If yes, any not cross 
linked SU8 should react and release a white-ish foam. If it does it 
means it's crosslinked already in which case you'd have to turn to your 
exposure method and find out what's wrong.

mems-talk-request <at> memsnet.org a écrit :
> Hello,
>
> I am graduate student in Brooklyn College and I am trying to reinvent the wholeMEMS  procedure as I do not
have any professional help. My science adviser is from another field.
>
> I am having difficulties with the developing of SU-8 2025. Here is what I am doing:
>
> I am spin - coating 4 inch Si or Pyrex wafer to 50 - 60 um thin film
> Pre - baking at 96 degrees for 15 min
> Sometimes instead I am putting the wafer in the vacuum chamber of my UV imprinter. The vacuum is taking away
the solvent and clear most of the bubbles.
> UV exposure with a hand made Imprinter: Xenon lamp 22kV at 10 microsec. pulses. Three 30 seconds exposures
with couple of seconds pause.
> UV lamp creates heat so the wafer is let for 2 - 3 min to relax.
> Post bake of 15 min at 95 degrees.
>
> Developing by tenderly shaking the wafer in a vessel with Propylene glycol monomethyl ether forever.
>
> The result is that I clearly can see my pattern as exposed SU-8 is yelowish but the unexposed parts are not
removed and form thin film with the exposed part.
> Less exposure leads to removing all of the polymer.
> (This is happening even without any mask but the pattern is formed by metal structure that divides 4 inch
wafer into several smaller regions.)
>
> Can anybody figure out what is my mistake?
>
> Thank you
> Dimitar Dimitrov
>
>
> ------------------------------
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Dimitar Dimitrov | 7 Jul 19:25 2014

[mems-talk] Unremoved SU-8 after exposure


Hello,

I am graduate student in Brooklyn College and I am trying to reinvent the whole MEMS procedure as I do not have
any professional help. My science adviser is from another field.

I am having difficulties with the developing of SU-8 2025. Here is what I am doing:

I am spin - coating 4 inch Si or Pyrex wafer to 50 - 60 um thin film
Pre - baking at 96 degrees for 15 min
Sometimes instead I am putting the wafer in the vacuum chamber of my UV imprinter. The vacuum is taking away
the solvent and clear most of the bubbles. 
UV exposure with a hand made Imprinter: Xenon lamp 22kV at 10 microsec. pulses. Three 30 seconds exposures
with couple of seconds pause.
UV lamp creates heat so the wafer is let for 2 - 3 min to relax.
Post bake of 15 min at 95 degrees.

Developing by tenderly shaking the wafer in a vessel with Propylene glycol monomethyl ether forever.

The result is that I clearly can see my pattern as exposed SU-8 is yelowish but the unexposed parts are not
removed and form thin film with the exposed part.
Less exposure leads to removing all of the polymer. 
(This is happening even without any mask but the pattern is formed by metal structure that divides 4 inch
wafer into several smaller regions.)

Can anybody figure out what is my mistake?

Thank you
Dimitar Dimitrov
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Gmane